09:00 |
Opening |
Andreas SCHULZE (imec) |
09:10 |
Keynote: Materials Innovation for Technology Scaling and the Implications to Metrology |
Zhiyong MA (Intel) |
09:55 |
Keynote: Metrology Challenges and Needs for Scaled 3D Devices and Architectures |
Ajey JACOB (GlobalFoundries) |
10:40 |
Coffee Break |
11:10 |
Invited: Automated Nearline Process Control Workflows for 3D NAND and FinFET |
Ozan UGURLU (Thermo Fisher Scientific) |
11:45 |
2D & 3D Advanced Transmission Electron Microscopy for Semiconductor Characterization |
Vincent DELAYE (LETI) |
12:05 |
Advanced Micro Probes for Semiconductor Metrology |
Andrea CASCI CECCACCI (Capres) |
12:25 |
Lunch |
13:30 |
Invited: YieldStar Metrology System Applications for Advanced Process Control |
Paul HINNEN (ASML) |
14:05 |
AFM-based Metrology for Advanced Patterning |
Alain MOUSSA (imec) |
14:25 |
3DSEM Measurements of Stacked-NW Transistor Height Using New eTilt Metrology Algorithm |
Remi LE TIEC (AMAT) |
14:45 |
Coffee Break |
15:15 |
Invited: Characterization Requirements of the CMOS Industry |
Paul VAN DER HEIDE (imec) |
15:50 |
Atom Probe Tomography Simulation of a Cross Section ABA Structure |
David J. LARSON (Cameca) |
16:10 |
Raman and Second-Harmonic Generation Spectroscopy For Probing The Orientation and Charge Density of MoS2 |
Vincent VANDALON (TU Eindhoven) |
16:30 |
Reception |