| 09:00 |
| Opening |
| Andreas SCHULZE (imec) |
| |
| 09:10 |
| Keynote: Materials Innovation for Technology Scaling and the Implications to Metrology |
| Zhiyong MA (Intel) |
| |
09:55
|
| Keynote: Metrology Challenges and Needs for Scaled 3D Devices and Architectures |
| Ajey JACOB (GlobalFoundries) |
| |
10:40
|
| Coffee Break |
| |
11:10
|
| Invited: Automated Nearline Process Control Workflows for 3D NAND and FinFET |
| Ozan UGURLU (Thermo Fisher Scientific) |
| |
11:45
|
| 2D & 3D Advanced Transmission Electron Microscopy for Semiconductor Characterization |
| Vincent DELAYE (LETI) |
| |
12:05
|
| Advanced Micro Probes for Semiconductor Metrology |
| Andrea CASCI CECCACCI (Capres) |
| |
| 12:25 |
| Lunch |
| |
13:30
|
| Invited: YieldStar Metrology System Applications for Advanced Process Control |
| Paul HINNEN (ASML) |
| |
14:05
|
| AFM-based Metrology for Advanced Patterning |
| Alain MOUSSA (imec) |
| |
| 14:25 |
| 3DSEM Measurements of Stacked-NW Transistor Height Using New eTilt Metrology Algorithm |
| Remi LE TIEC (AMAT) |
| |
| 14:45 |
| Coffee Break |
| |
| 15:15 |
| Invited: Characterization Requirements of the CMOS Industry |
| Paul VAN DER HEIDE (imec) |
| |
| 15:50 |
| Atom Probe Tomography Simulation of a Cross Section ABA Structure |
| David J. LARSON (Cameca) |
| |
| 16:10 |
| Raman and Second-Harmonic Generation Spectroscopy For Probing The Orientation and Charge Density of MoS2 |
| Vincent VANDALON (TU Eindhoven) |
| |
16:30
|
| Reception |
